Abstract: Monolithic 3D stacking of complementary FET (CFET) SRAM arrays increases integration density multi-fold while supporting the inherent SRAM advantages of low write power and near-infinite ...
Abstract: Monolithic 3-D (M3D) integrated circuits (ICs) introduce a new aspect to the physical design problem by stacking dies vertically. We introduce a novel heterogeneous design for M3D ICs, which ...
A job listing reveals the first details of Google’s fusion of Android and ChromeOS. A job listing reveals the first details of Google’s fusion of Android and ChromeOS. is a news editor with over a ...
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