By applying machine learning techniques, engineers at MIT have created a new method for 3D printing metal alloys that produce parts far stronger than those made using traditional manufacturing ...

Unexpected change rewards those who are quick to adjust, but all aspects of a system must be adjusted to keep growth going.

As chip designs become larger and more complex, especially for AI and high-performance computing workloads, it’s often not ...

TE Connectivity offers a range of connectivity and sensor systems that it has tested in some of the harshest environments.

November, records show, CPD officers in 2025 have recovered nearly 400 “ghost guns” — effectively untraceable weapons.

“Photon Design's next-generation, EPIPPROP simulator, will offer the flexibility to split waveguides, simulating this process ...

As liquid-cooled AI data centers scale at hyperscale speed, Rob Lowe argues that long-term reliability, cost control, and ...

At CES 2026 (January 6-9 in Las Vegas), aiMotive and LG will introduce the HPC Lite platform. Able to efficiently manage the complex functions of next-generation vehicles, the platform is expected to ...

On Dec. 15, Nvidia (NVDA) announced the launch of its Nemotron 3 family of open models, built to support transparent, ...

Autodesk (ADSK) has fully transitioned to a SaaS model, driving gross margins above 92% and free cash flow margins near 37%.

This report covers key regulatory updates, new model launches, and funding and M&A activity shaping the market.

PCIe/NVMe SSDs Tested for Compatibility and Interoperability in the 2.5-inch Form Factor ...