Minneapolis, MN – The SMTA is excited to announce the technical program for the 2026 Wafer-Level Packaging Symposium. The symposium will be held February 17-19, 2026 at The Hyatt Regency San Francisco ...

As chip designs become larger and more complex, especially for AI and high-performance computing workloads, it’s often not ...

According to projections from Towards Packaging, the global advanced packaging market is set to increase from USD 43.04 ...

FREMONT, CA / ACCESS Newswire / November 12, 2025 / Aehr Test Systems (NASDAQ:AEHR), a worldwide supplier of semiconductor test and burn-in solutions, today announced the shipment of its Dual-Echo™ ...

Thank you. I am Yoshida from CLSA Securities. Thank you. First of all, I would like to ask you to give us an overall summary of the actual shipment amount and the Q2 forecast, which we always ask you ...

Considered something of a necessary evil, burn-in of IC packages during production does a great job of weeding out latent defects so they don’t turn into failures in the field. But as AI and ...

Abstract: In this study, we present a low interconnection loss antenna-in-package (AiP) using a chip-embedded metal fan-out wafer-level package (mFOWLP) technology for D-band (110–170 GHz) ...